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Do's and Don'ts for PCB Layer Stack-up
Each day the electronic gadgets complexity increases with the miniaturization requirements, boards are becoming much denser. Multilayer PCB technology can satisfy today’s miniaturization board requirement. Multilayer PCBs has more than two layers of PCBs, arrangement of layer should be done with great care because inefficient layer arrangement will lead to the noisy board with unexpected performances. This article addresses the layer stack-up basics and the general layer stack-up considerations. 2 . Layer stack-up basics Layer stack-up specifies the proper arrangement of circuit board layers for multilayer boards before starting board layout design. Stack-up mainly defines which layers should be solid power and ground planes, the substrate (dielectric constant), and the spacing between layers. While planning a layer stack-up, also compute the desired trace dimension and minimum trace spacing. SIDE VIEW Multilayer boards ...
Difference between through hole and Surface mount components
As technology grows the demand for less weight and smaller size component increases. This leads to new improved technology known as surface mount technology (SMT). Surface mount components are similar to plated through hole as far as there electrical function is concerned but the key difference is in their size. The small size of surface mount components (SMC) provides better electrical performance. Surface mount components are placed or mount directly on Printed circuit board (PCB) which means they do not require hole for mounting the component. They can be directly soldered on track side. Surface mount components have different shape leads and they have little circular at bottom etc for soldering as shown in figure below. SMD devices are mainly found in multi-layer PCB where size of device is major concern. They can also be used on boards or devices which contain both through hole and SMC because some components like transformer, heat sink are not suitable...
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