how to add stiching via in pads layout

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Do's and Don'ts for PCB Layer Stack-up

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Each day the electronic gadgets complexity increases with the miniaturization requirements, boards are becoming much denser. Multilayer PCB technology can satisfy today’s miniaturization board requirement. Multilayer PCBs has more than two layers of PCBs, arrangement of layer should be done with great care because inefficient layer arrangement will lead to the noisy board with unexpected performances. This article addresses the layer stack-up basics and the general layer stack-up considerations. 2 . Layer stack-up basics  Layer stack-up specifies the proper arrangement of circuit board layers for multilayer boards before starting board layout design.  Stack-up mainly defines which layers should be solid power and ground planes, the substrate (dielectric constant), and the spacing between layers.  While planning a layer stack-up, also compute the desired trace dimension and minimum trace spacing. SIDE VIEW    Multilayer boards are made up of one or mo
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Types of Components Used in PCB and their explanations.

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In recent years, semiconductor packaging has evolved with an increased demand for greater functionality, smaller size, and added utility. A modern PCBA design has two main methods for mounting components onto a PCB:  Through-Hole Mounting  and  Surface Mounting.   Through-Hole Components Through-Hole Mounting (THM): Through-hole mounting is the process by which component leads are placed into drilled holes on a bare PCB. The process was standard practice until the rise of surface mount technology (SMT) in the 1980s, at which time it was expected to completely phase out through-hole. Yet, despite a severe drop in popularity over the years, through-hole technology has proven resilient in the age of SMT, offering a number of advantages and niche applications: namely, reliability.   Through-hole components are best used for high-reliability products that require stronger connections between layers. Whereas SMT components are secured only by solder
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