FEW Abbreviation AND THEIR EXPLANATION RELATED TO PCB DESIGN

AGND - Analogue Ground - separate ground for analogue signals.

CAN - Controller Area Network - a bus that is manly used in automotive and industrial environment.

DRC - Design Rule Check - a tool for checking whether all design rules are satisfied in a CAD tool.

DSI - Display Serial Interface.

EDA- Electronic Design Automation - software for schematic capture and PCB layout (CAD or ECAD).

EMC - Electromagnetic Compatibility -theory of unintentional generation, propagation, and reception of electromagnetic energy.

EMI- Electromagnetic Interference - high frequency disturbances.

eMMC - Embedded Multi Media Card - flash memory combined with MMC interface controller in a BGA package,used as internal flash memory.

ESD - Electrostatic Discharge - high voltage spike or spark that can damage electrostatic-sensitive devices.

GBE - Gigabit Ethernet - Ethernet interface with a maximum data rate of 1000Mbit/s.

GND - Ground

GPIO - General Purpose Input/Output pin that can be configured to be either an input or output.

I2C- Inter-Integrated Circuit- a two wire interface for connecting low speed peripherals.

I2S - Integrated Interchip Sound- a serial bus for connecting PCM audio data between two devices.

IrDA - Infrared Data Association - an infrared interface for connecting peripherals.

JTAG - Joint Test Action Group - widely used debug interface.

LSB - Least Significant Bit.

N/A-Not Available.

N/C - Not Connected.

RGB- Red Green Blue - color channels in common display interfaces.

RJ45 - Registered Jack - a common name for the 8P8C modular connector that is used for Ethernet wiring.



Comments

Post a Comment

Popular posts from this blog

Identifying Potential EMI Sources and Victims

Image
As mentioned in my previous Article i am trying to elaborate the EMI source and victims. After seeing the word EMI you must be thinking  what is it? Below is the small definition of EMI. Electromagnetic Interference (EMI) The process where disruptive electromagnetic energy is transmitted from one electronic device to another via radiated or conducted paths. –  Radiated Emissions -The component of RF (roughly 10kHz to 100GHz) energy transmitted through a medium, usually free space (air), as an electromagnetic field. –  Conducted Emissions -The component of RF energy transmitted as a propagating wave generally through a wire or interconnect cable. LCI (Line conducted interference) refers to RF energy in the power cord.   A typical circuit board may have dozens, hundreds or even thousands of circuits. Each circuit is a potential source of energy that might eventually be coupled unintentionally to other circuits or devices. Each circuit is also a poten...
Read more

Do's and Don'ts for PCB Layer Stack-up

Image
Each day the electronic gadgets complexity increases with the miniaturization requirements, boards are becoming much denser. Multilayer PCB technology can satisfy today’s miniaturization board requirement. Multilayer PCBs has more than two layers of PCBs, arrangement of layer should be done with great care because inefficient layer arrangement will lead to the noisy board with unexpected performances. This article addresses the layer stack-up basics and the general layer stack-up considerations. 2 . Layer stack-up basics  Layer stack-up specifies the proper arrangement of circuit board layers for multilayer boards before starting board layout design.  Stack-up mainly defines which layers should be solid power and ground planes, the substrate (dielectric constant), and the spacing between layers.  While planning a layer stack-up, also compute the desired trace dimension and minimum trace spacing. SIDE VIEW    Multilayer boards ...
Read more